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RELIFE SP-X Solder Paste
Relife SP-X solder paste (50g) is specially formulated for high-precision soldering work, ideal for BGA, SMD, SMT applications, and stencil repairs. Designed to meet the demands of micro-soldering technicians, it guarantees reliable, clean, and long-lasting results, even in the most demanding environments.
Key Features:
- High melting point of 158°C: Ensures strong, heat-resistant solder joints, ideal for high-temperature sensitive components.
- Special interlayer formulation: Optimized for repairs on the inner layers of multi-layer motherboards.
- Excellent wettability: Promotes even solder spread for optimal adhesion to components.
- Low residue: Leaves very little residue after soldering, for a clean workstation and professional results.
- High insulation resistance: Preserves circuit integrity and reduces the risk of short circuits.