Rebillage IC plate for Samsung all models up to S21 - RL-044 SAM - 15 pieces
The RELIFE RL-044 SAMS CPU Stencil Kit is specially designed for repairing and reballing Samsung smartphone chips. It includes 15 ultra-precise stainless steel stencils, suitable for major Samsung models on the market.
Key Features:
- Designed for mobile chips: High-precision round and square holes ensure consistent solder balls and optimal tinning.
- Ultra-thin design: Better adaptation during tinning, with excellent flexibility and resistance to repeated bending.
- High-quality special steel: High resistance to high temperatures and metal fatigue, ensuring uniform heating of each solder point.
- Mixed sizes: Partial-cut and full-cut designs to meet different reballing needs.
- Wide compatibility: Suitable for most currently available Samsung smartphone models.